Bondexpo 2024 in Stuttgart

Bondexpo, a leading trade fair for bonding technology, will take place at Messe Stuttgart from October 8 to 11, 2024. With a special focus on the process chain of joining and connecting materials by bonding, potting, sealing and foaming, the trade fair addresses current and future challenges in this field. As an integral part of the trade fair network with Motek, Bondexpo offers a comprehensive insight into innovative solutions and systems for optimizing manufacturing processes.

Main topics of Bondexpo 2024:

• Joining and bonding technologies: New technologies and materials for bonding, potting, sealing and foaming.
• Efficiency and economy: Solutions for increasing productivity in manufacturing.
• Sustainability: Approaches to reducing CO2 emissions and conserving resources in the production industry.
• Digitalization: Use of intelligent systems and automation to improve manufacturing processes.

Together with Motek, which runs in parallel, Bondexpo offers a platform for experts and companies to discuss the latest technologies and methods in production automation. The focus is on topics such as digitalization, resource conservation and automation, which make a significant contribution to overcoming challenges such as the shortage of skilled workers and increasing efficiency. The trade fair is a must for experts from the fields of production, development and research who are looking for innovative, future-proof solutions to optimize their processes and remain competitive.

At the last Bondexpo and Motek in 2023, 24,492 trade visitors were inspired by the offerings of the 496 exhibitors from 22 countries and filled the corridors of the three exhibition halls with intensive specialist talks and discussions.

The text is based on a language draft by ChatGPT. The author has thoroughly reviewed and revised the content before publication.